Loongson 3C5000L ​

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Basic Information

Product Name

3C5000L

Product Series

3C5000

Market Segment

Server

CPU/SoC Specifications

Cores

16

Threads

16

Microarchitecture

LA464

Max Frequency

2.2 GHz

L1 Instruction Cache

64 KiB

L1 Data Cache

64 KiB

L2 Cache (Total)

4 MiB (256 KiB × 16)

L3 Cache (Shared)

64 MiB (16 MiB × 4)

Typical Voltage

1.15 V

Typical Power Consumption

150 W

Thermal Design Power (TDP)

200 W

GPU Specifications

Integrated GPU

No

GPU Name

N/A

Memory Specifications

Max Memory Size

N/A

Memory Type

DDR4-3200

Memory Channels

4 (72-Bit)

ECC Memory

Supported

Expansion

I/O Interface

HyperTransport

I/O Interface Revision

3.0

Lanes

32 (4 × 8)

USB 3.2 Gen 1 (5Gbps)

N/A

USB 2.0

N/A

SATA

N/A

Ethernet

N/A

SPI

1

UART

1

I2C

3

AVS

1

GPIO

16

Multi-Die Support

Supported

Die-to-Die Connection

HyperTransport 3.0

Other Interfaces

N/A

Package Specifications

Socket

FCBGA2422

Temperature Range

0 - 70℃

T_CASE

70℃

T_JUNCTION

85℃

Package Size

49.9 mm × 49.9 mm

Power Management

Clock Gating

Supported

Dynamic Frequency Scaling

Supported

Adaptive Voltage Scaling

Supported

Instruction Set Architecture

Instruction Set

64-Bit

ISA Extensions

LBTLVZLSXLASX

Notices ​

1. Only 1 of the 4 HyperTransport 3.0 buses is used for I/O connectivity (HT0), while the other can only be used for ccNUMA (HT1, HT2, HT3).